Semiconductor Development

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The Taiwan Semiconductor Research Institute (TSRI) of NARLabs has been dedicated to supporting the academia for its research to develop advanced semiconductor processing technologies and cultivating semiconductor talents. TSRI is positioned as a service provider of Taiwanese industry, academic, and research sectors specializing in semiconductor research. TSRI provides the only open laboratory research environment in Taiwan that is fully equipped with technologies for device manufacturing, circuit design, and system integration and employs a team of experts in life sciences, optics, electronics, machinery, circuit design, or system engineering who collaborate through various means to achieve multidisciplinary research outcomes and develop multidisciplinary techniques. TSRI→

Advanced Fabrication Technologies

To improve process capability and integrate national resources, TSRI has built a next-generation device manufacturing and integration technology research platform, formed various work teams for information security/facilities/occupational safety management, and provided users with a safe use environment. TSRI also looks forward to working with academic and research communities in the R&D of advanced semiconductor manufacturing and nanofabrication processes and device technologies, fostering the top tech talent desperately needed by the academic and industry communities, and combining the strength of the industry, academic and research communities for the development of advanced device technologies, thereby lowering the investment risk that may arise from technical bottlenecks while boosting the independent R&D capabilities of semiconductor-related industries in Taiwan.

Next Generation Device Technology

TSRI is dedicated to developing High-density, high-performance, low-power, 3D stacked transistor device technologies that meet the requirements of academic and industrial applications. It also provides domestic R&D teams with an R&D platform that is up to the industrial standard to facilitate research and development of advanced devices.

Innovative Memory

TSRI provides various innovative non-volatile memory devices and array circuit integration technologies for the academic research community to carry out material research, application prototype verification, and system integration development.

GaN Power Device Technology

TSRI established a 6” and 8” all-GaN IC process line, realized a 50A/650V GaH high-power device and a 12V power management circuit, and successfully developed a 75 GHz GaH high-power RF communication device and a power/RF device high-thermal conductivity packaging module.

Chip Design Innovation

To meet academia’s needs for research on AI SoC design platforms, smart sensing chips, low-power IoT design platforms, silicon photonics integration systems, and CMOS-MEMS sensing platforms and to promote the future development of the industry, TSRI has introduced multiple computer-aided design software packages for chip and system design that are widely used in the industry, as well as multiple SIP databases which are available for free to schools upon application. For front-end design, physical design, rapid prototyping, system technology design, and embedded software design, TSRI has also integrated design software, planned and built complete chip and system design processes and environments to improve the efficiency of chip and system design, and provided designers with technical support, training courses, maintenance of rapid prototype verification and design environments, and other required services during design, including the integration of design databases and the creation of technical data files in design environments.

Low-power low-noise SoC

TSRI Successfully integrated three-axis accelerometers, readout circuits, an ADC, an ARM M0 MCU, and a memory into a single chip. With the algorithm calibration sensor, the three-axis accelerometer SoC is currently the most highly integrated in the world.

CMOS MEMS Technology

TSRI's domestic R&D team and CMOS foundry jointly developed and provided a one-stop integrated CMOS MEMS sensor chip design and production platform.